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Posted: Friday, March 17, 2017 1:11 AM


You will use your knowledge of hardware, software, device physics, process technologies, and analytical instrumentation to develop electrical stresses to quantify failure mechanisms within Intel's next generation wireless communication products. These products range from 3rd party hard IP to die level, standalone ICs, modules, boards, and systems. They also include both internal and external manufacturing technologies. Relying on your technical judgment, you will extrapolate existing methods or invent new ones to accelerate Intel's wireless solutions into the marketplace. This role emphasizes your system engineering expertise focused on HTOL and Burn-in technologies, your strategic influencing skills and your initiative to enable extreme collaboration. Through this collaboration, you will drive synergies and unified business goals among the OSAT, Connectivity, Cellular, TMG ASM solutions. It will also provide you the opportunity to research mechanisms unique to RF technologies. As such, you will work closely with Process Technology, Package Development, Design, Product Development, Quality and Reliability, HVM, Vendor, and Customer Engineers.


Qualifications

Qualifications:The ideal candidate will have a BS or MS in Electrical Engineering with 5+ years of HTOL/Burn-in systems and stress development, DFT/DFx for Burn-in, RF circuit constraints, and a proven track record of effective collaboration between engineering organizations. You will use your strong problem solving skills and knowledge of rf circuits and HTOL/BI systems to bridge between external and internal solutions and organizations. Experience with Incal, SH2, or LCBI stress systems is a plus. This is a position of influence, spanning multiple engineering disciplines, geographical teams/cultures, and customers. Your and the team's conclusions will direct business decisions. As such, you will rely on your strong organization skills, attention to detail, and communication skills [both written and oral]. Additional qualifications or advantages include: Successful track record of Influence through: Impact/Initiative/Inertia/Innovation/Intensity/Impatience/Inclusion/Instructing othersSuccessful track record of leading small teams to achieve maximum business impactAbility to drive solutions and lead teams that support business models where Intel is both a leader and a new entrant. Technical problem solving, communications, and time management skills Broad technical and teamwork skillsKnowledge and/or experience both internal [ATM/HVM] and external stress solutionsWorking knowledge of stress pattern conversion and debugKnowledge and/or experience in CAD and/or EDA includes UNIX*, Cadence*, Allegro*, VtpSim*, VHDL, Verilog, and H-Spice* environments Experience with RF, serial transceivers, or Media Access Control (MAC) components

Inside this Business Group

The Platform Engineering Group (PEG) is responsible for the design, development, and production of system-on-a-chip (SoC) products that go into Intel’s next generation client and mobile platforms. PEG strives to lead the industry moving forward through product innovation and world class engineering.


Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.

Click here for more info: http://jobs.intel.com/ShowJob/Id/1012356/Leader-iCDG-CQN-rf-products-electrical-stress-technology-development-and-execution/


• Location: Sacramento

• Post ID: 13530695 sacramento
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